IPC-7530回流焊温度曲线控制.pdf

ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) IPC-7530 May 2001 A guide developed by IPC 2215 Sanders Road, Northbrook, IL 60062-6135 Tel. 847.509.9700 Fax 847.509.9798 The Principles of In May 1995 the IPC’s Technical Activities Executive Committee adopted Principles of Standardization Standardization as a guiding principle of IPC’s standardization efforts. Standards Should: Standards Should Not: • Show relationship to Design for Manufacturability • Inhibit innovation (DFM) and Design for the Environment (DFE) • Increase time-to-market • Minimize time to market • Keep people out • Contain simple (simplified) language • Increase cycle time • Just include spec information • Tell you how to make something • Focus on end product performance • Contain anything that cannot • Include a feedback system on use and be defended with data problems for future improvement Notice IPC Standards and Publications are designed to serve the public interest through eliminatin