次亚磷酸钠体系化学镀镍沉积机理探讨_刘永健.pdfVIP

Vol. 27 No. 3 2001-06 Journal of East China University of Science and echnology 301 : 1006-3080(2001) 03-0301-06 刘永健,　王印培* (华东理工大学化工机械研究所, 上海200237) : 探讨了次亚磷酸钠体系化学 镍沉积机理。认为 层的微观形貌和成分均匀性与 层 “沉积表面”和 “层锋线”的镍离子活度密切相关。指出采用混合配体可降低 “H-P ”均裂所需要的 能量, 有利于 层以锋线推进的层片状方式生长, 提高 层的耐蚀性; 液中添加适量稀土, 增加催 化表面的活性点数目, 加快镍离子被还原过程中电子传递速度, 提高 层的沉积速度和耐蚀性。 : 化学 镍; 次亚磷酸钠; 沉积机理; 耐蚀性 + : Q153. 1 2 :A The Mechanism of Electroless Nickel Deposition in Sodium Hypophosphite Bath - , - LI U Yong j ian WA N G Yin p ei (Institute of Process Equip ment and Pressure Vessels ECUS , Shanghai 200237, China) Abstract: he mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed It. is assumed that the microscopic shape and ingredient homogeneousness of deposition depends on the local nickel effective content near the deposit surface and deposition front. It is suggested that the adoption of mixing complexions can lower the energy required by the homolysis of H-Pband, favorable to the - . growth of deposition by synusia like model Small amount of rare earth element added in eletrolyte can enhance the depositing rates and corrosion resistant of deposition by increasing the number of the active spots in nickel surface and the rates of electron transfers in reaction. : - ; ; ; Key words eletroless nickel plating sodium hypophosphite deposition mechanism corrosion resis- tant - - + H2PO2 + H2O HPO3 + H + 2H+ e ( 1)