00130-无铅焊锡球格数组构装接点之冷热循环与动态疲劳分析(第二年).docVIP

行政院国家科学委员会专题研究计划成果报告 无铅焊锡球格数组构装接点之冷热循环与动态疲劳分析(第二年) The analysis of temperature cycling and dynamic fatigue for the lead-free solder joints in the ball grid array package(2nd year) 计 画 编 号：NSC90-2216-E-002-032 执 行 期 限：90 年 8 月 1 日 至 91 年 7 月 31 日 主 持 人 ：庄东汉教授 台湾大学材料系 一、中文摘要： 球 格 阵 列 构 装 (BGA) 具 有 高 密 度、优良电性与散热性、低成本、高产 品良率等优点，再加上其与表面实装技 术的共容性，使其快速普及化。因应电 子工业无铅焊锡的时代潮流，本群体计 画将针对球格数组构装改用无铅焊锡 球之制程与可靠度进行研发分析。针对 可靠度试验，本子计划主要负责「冷热 循环试验」与「动态疲劳试验」。本年 度先以Sn-58Bi无铅焊锡为对象，进行 动态疲劳试验及冷热循环试验，同时加 入电性分析，以提供更直接的应用参考 数据，也将藉此有系统的探讨锡球接点 介金属成长、组织变化以及裂缝形成等 对于接点电性的影响。 关键词：无铅焊锡，球格数组构装，冷 热循环试验，动态疲劳试验，电性分析 ABSTRACT: Among the merits of ball grid array (BGA) packages are high I/O density, good electrical properties, fine heat dissipation capability, low cost and high yield rates. It is small wonder that BGA has been gaining popularity in related fields when capped with the compatibility with surface mount technology (SMT). Responding to the lead-free trend in the electronic industry, this project is devoted to the manufacturing study and reliability analysis of ball grid array packages by adopting Pb-free solder balls in lieu of traditional Pb-Sn solders. With respect to the reliability analysis, temperature cycling and dynamic fatigue testing are scheduled in this subprogram. In the second year of this project, the electrical analyses have been involved in addition to the dynamic fatigue test and thermal cycling test, in order to shed more light on viable data resources for the applications. Through the electrical analysis, the influences of intermetallic growth, microstructure changes and crack formation upon the electrical properties of solder joints will also be systematically investigated. Keywords: Pb-free solder, ball grid array package, temperature cycling test, dynamic fatigue test, electrical analysis.  二、计划源由与目的 有关ＢＧＡ焊锡接点的热疲劳、潜 变等研究已在国内外杂志及文献刊登 了很多，但对于某些人机接口（如：按