电子元器件的激光微细加工技术及设备研究.pdfVIP

摘 要 随着电子制造业的迅猛发展，传统的制造加工工艺已越来越难以满足现代电子制 造工艺的要求。与传统的加工工艺技术相比，激光加工技术有着其独特的优越性，显 现出巨大的工业化前景。 在相关电子制造企业的资助下，我们在国内研制了一台多功能激光微加工设备， 把激光微细加工技术应用到线绕电位器的生产制造中，成功实现了电位器绕组引丝、 在绕组上布置导体使其短路、薄金属片之间焊接和金属元件表面打标等复杂工艺。 根据电位器制造工艺要求，提出了多功能激光加工设备总体方案。该设备配置了 两台YAG 激光器，两个工作台，光路可自由切换，系统集成度高，满足了线绕电位器 多工位的生产要求。数控工作台采用“NC 嵌入PC ”结构的开放式数控系统，工作台 定位精度为±0.005mm，工件的激光微加工位置由CCD 实现精确定位。 对电位器绕组引丝、短路的激光加工工艺进行了详细的研究和探讨，讨论了聚合 物导体浆料的成分选择，并在试验的基础上分析了聚合物导体浆料在激光作用下成型、 导电机理。电位器绕组引丝焊点可控制在3 匝电阻丝(100µm) 以内；短路位置精确可控， o 偏差为±1 ，导电性能良好。 通过本文的研究，实现了电子元器件的激光微加工，建立了相应的设备，并最终 将其成功地应用到工业生产中，产生了显著的经济效益和社会效益。 关键词：激光微加工 Nd:YAG 激光器 运动控制卡 电位器 导体浆料 I Abstract Nowadays the electronic manufacturing are developing faster and faster that traditional machining technology can not meet its demand in many situations. However laser micro machining technology can solve this problem in some extent because of its special superiority. Some outstanding advantages have shown a bright applications prospect in industry. With the financial support of a electronic company, a multifunction laser machining equipment used in the manufacture of coiled potentiometer was designed and fabricated, in which the laser micro machining technology was used to realize some complex processes such as joining a conductive thread on the coil, coating conductive pastes on the surface of coil to make a shortcut of a circuit, welding between two metallic slices , marking on the surface of metal component , etc. According to the requirement of manufacturing process of coil potentiometer, we put forward a new scheme for the multifunction laser machining equipment, which was composed of two YAG