Design guidelines for aluminum wire wedge bonding.docVIP

REVISION HISTORY Revision Description of Change Writer/Reviser Effective Date A New Release Weifeng Liu/Dick Pang 10/03/2013  Optional Section (see footnote) APPROVERS Author Name Title Department Name Weifeng Liu Senior Microelectronics Engineer MEP, AEG Dick Pang Microelectronics Engineer MEP, AEG Author’s Manager Name Title Department Name Anwar Mohammed Senior Director ATT/MEP, AEG AEG VP Name Title Department Name Murad Kurwa Advanced Engineering Group VP Advanced Engineering Group Optional Section ABOUT FLEXTRONICS Flextronics is a leading Electronics Manufacturing Services (EMS) provider focused on delivering complete design, engineering and manufacturing services to automotive, computing, consumer, industrial, infrastructure, medical, clean tech and mobile OEMs. Flextronics helps customers design, build, ship, and service electronics products through a network of facilities in 30 countries on four continents. This global presence provides design and engineering solutions that are combined with core electronics manufacturing and logistics services, and vertically integrated with components technologies, to optimize customer operations by lowering costs and reducing time to market.  BACKGROUND/INTRODUCTION N/A PURPOSE This document was created to present aluminum wire wedge bonding process capability and design guidelines we can offer to current and potential new customers. SCOPE This document is mainly to cover the following processes: Aluminum ultrasonic wedge bonding DEFINITIONS and ABBREVIATIONS N/A REFERENCES Document Title Document Number Document \ Hyperlink Guidelines for Chip-on-Board Technology Implementation IPC-SM-784 TEST METHOD STANDARD MICROCIRCUITS MIL-STD-883H POLICY STATEMENT N/A PROCESS FLOW CHART Aluminum Wedge Bonding Process PROCEDURE RESPONSIBILITY N/A TRAINING REQUIREMENTS N/A KEY PERFORMANCE INDICATORS AND METRICS Al Wire Ultrasonic Wedge Bonding Spec Standard General design rules