19 Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes外文翻译.pdfVIP

Chapter 19 Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes K. Mohan Kumar(*ü ), V. Kripesh, and Andrew A.O. Tay 19.1 Introduction As integrated circuit (IC) technology continues to advance, there will be increasing demands on I/O counts and power requirements, leading to decreasing solder pitch and increasing current density for solder balls in high-density wafer-level packages [1] . As the ele