成都电子科技大学硕士研究生学术英语听说与读写课程作业模板祥解.ppt

Electronic device Electricity suppliers communication field How does the development direction? miniaturization With the rapid development of mobile communication and satellite communication, the requirements for miniaturization of devices are becoming more and more urgent.In particular, the use of electronic ceramic materials based on various types of passive components, is the main bottleneck of the miniaturization of the whole machine. Therefore, miniaturization (including chip) is an important target for research and development of components, the market demand is also very strong. High frequency and frequency series High frequency is the inevitable trend of the development of digital 3C products. To mobile communication as an example, the main characteristics of the first generation mobile communication is in the 800 ~ 900MHz, the second generation mobile communication with digital signal as the main characteristics is 900MHz and 1.8GHz,at present, the frequency of the third generation mobile communication system is studied in 2GHz. How to adapt to the high working frequency is a severe challenge to the ceramic material of all kinds of electronic components.Therefore, it is a hot research topic in the field of new electronic components to find the functional ceramic material with good high frequency characteristics and series of working frequency. Integration and modularization At present, the mobile phone and notebook computer to further more convenient, more functional, full digital and high integration and low cost direction development, greatly promoted the electronic components of the chip, miniaturization and low cost and device combination, functional integration of the development process. Integrated functional ceramic components are based on low temperature cofired ceramic as the platform,multilayer ceramic technology is adopted to integrate the capacitance, inductance and resistance material into the low temperature cofired ceramic substrate, formin