BGA封装1.pptVIP

Electroplating Solder Bumping Flip Chip Technology电镀焊球凸点倒装焊技术 Electroplating Solder Bumping Process电镀焊球凸点工艺 Process Flow of Electroplating Solder Bump 电镀焊球凸点工艺流程 Process Specification工艺参数 Flip Chip on Low-Cost Substrate Samples Stencil Printing Bumping Flip Chip Technology丝网印刷凸点倒装焊技术 Electroless UBM and Stencil Printing化学镀UBM和丝网印刷工艺 The most potential low cost flip chip bumping method. 最具前景的低成本倒装焊凸点制备方法 Using electroless Ni/Au as UBM system 用化学镀镍/金作为凸点下金属层 maskless process 无掩膜工艺 Compatible with SMT process 与表面贴装工艺兼容 Flexible for different solder alloys适用于不同焊料合金 Stencil Printing Process