成品防焊修补标准V1.docVIP

防焊修补标准（V.1 Solder mask touch-up standard. 防焊修补时，双面板或大铜面上每10cm2内不可超过3点,　多层板或线路上每10cm2内不可超过5点，且所有点需符合以下标准： Max 3 points touch-up for one side and 5 points touch-up for two sides are allowed when those points are complying with the following items. 点状防焊修补面积不可超过3 x 3mm。 Drop shape touch-up must be in 3 x 3mm. 条状防焊修补面积多层板线路上不可超过15 x 1mm，双面板线路不可超过10 x 1mm. Strip shape touch-up for multilayer must be in 15 x 1mm, for double sides must be in 10 x 1mm. 修补处不可有明显的色差（颜色太绿，太浅或发黑现象）。 The obvious discoloration of the touch-up is not allowed (e.g. more green, undertone or nigrescence). 修补油墨厚度不可明显超过原板面油墨厚度（手摸无明显凸起感）。 The thickness of touch-up S/M will not be tower above the original (the protrude will not be touched). 修补油墨不可有脱落现象(必须有首件检查合格)。 The touch-up solder mask is not allowed peeling after tape test (First Article Inspection are required). 修补处不可有油墨过薄而出现假性露铜现象。 The touch-up solder mask too thin is not allowed. 修补处油墨下面不可有氧化、沾锡或异物存在（须于修补前刮除）。 There is nothing allowed existing under the touch-up solder mask (e.g. oxidation, solder and foreign material, should be remove before touch-up). QFP、SMT、BGA区域内不可补油。 The area of QFP, SMT and BGA are not allowed touch-up. Pad 附近2mm内不可补油。 Touch-up within 2 mm of the pad is not allowed. 补油表面须光滑，有光泽，不可破坏周围油墨。 The touch-up surface will be smooth and polish, care not to damage the original solder mask. 12. 对于电测修短路的板子，出现并点短路时，多点连在一起，3 x 3mm范围内，修补时作一点修补。勿作多点修补。同时需遵循以上2~11点要求。 As for ET repairing boards of coordinate short, when the defects points are in a range of 3 x 3mm, all the points will be touched-up as one defect point. And all touch-up will keep compliance with the above item 2 ~ item 11. 核准：QA/Edmund Sing　　　　　　审核：QA/潘松　　　　　　　制定：FQC/潘恒清 新 美 亚 电 路（无 锡）有 限 公 司 Sanmina-sci Circuits (Wuxi) Co., Ltd.