Ku波段宽带大功率多芯片合成设计.pdfVIP

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Ku波段宽带大功率多芯片合成设计.pdf

第3 1卷 第6 期 V ol 31, N o 6            20 11 年12 月 RESEA R CH P RO GRESS OF S SE Dec , 2011 Ku 王 晔  成海峰 张 斌 ( , , , 2100 16) 20 11-05-20 , 20 11-09-27 : K u M M I C , Ku 6 W , 16 , 12 17 G Hz , 6 GHz 70 W , 15 dB , 48 V , 16 % , , 2 80 mm 170 mm 55 mm 4 1217 GHz 200 W : ; ; ; : T N 722 7+ 5; T N 73 : A : 1000 -3 819( 2011) 06-0563-05 Design of Ku Band 70 W Power Amplifiers WA N G Y eCH EN G Haif eng ZHA N G Bin ( Science and Technology on Monolithic Integ rated Circuits Modules Laboratory, Nanj ing Electronic Dev ices Institute, N anj ing, 2100 16 , CH N ) Abstract: T his p ap er sho w s a design of hig h po w er com binat ion f or Ku b and M MIC amplifi- 16- , 12 er We analyz ed t he channel pow er combining st ru ct ure and g ot a SSPA w it h a b and of 17 G Hz b ased o n a 6-Wat t am plif iers M MIC T he output pow er of t he SSP A is o ver 70 W w it h a gain o ver 15 dB T he PA E of this SSPA is mo re th an 16% in t he operat ing volt age of 4 8 V T he size is 2 80 mm 170 mm 55 mm 4 solid pow er like t his combined in 1217 GHz can gain more t han 200 W pow er export Key words: solid state; power amplifier; conbination; high-power EEACC: 1220; 1350F , 引  言 , , , 50 G aA s ( MM IC) , RP , , M M IC

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