原创力文档sn-ag-cu焊点imc生长规律及可靠性研究 the study of imcs growth and reliability of sn-ag-cu solder joint.pdfVIP
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sn-ag-cu焊点imc生长规律及可靠性研究 the study of imcs growth and reliability of sn-ag-cu solder joint
质 量 工 程 卷 可靠性分析与研究
Quality Engineering R
e
l
i
a
Sn-Ag-Cu焊点IMC生长规律及可靠性研究 b
i
l
Solder Joint i
1 1,2 t
y
何明敏 吴丰顺 1 1,2
He Ming-min ,Wu Feng-shun , Zhang
1 1,2 1
1 1,2 1 Wei-gang , Wu Yi-ping , An Bing
张伟刚 吴懿平 安 兵
A
1 华中科技大学材料学院 武汉 ( 1.Material College of Huaz hong
Univ e rs ity of Sc ie nce Tec hno logy, W uha n
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