WireBond焊线动作分解说明.PPT

CONTENTS 封裝簡介 封裝流程 Wafer Grinding Wire Bond 原理 B.PRINCIPLE 銲接條件 Bonding Process The Wire Bond Temp Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Formation of a first bond Formation of a first bond Formation of a first bondContact Formation of a first bondBase Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Formation of a loop Formation of a loop 2nd Search Height Formation of a second bond Formation of a second bondContact Tail Length Tail Length Tail Length Tail Length Disconnection of the tail Disconnection of the tail Disconnection of the tail Formation of a new free air ball Formation of a new free air ball Material Leadfram (I) Leadfram ( II ) CAPILLARY (I) CAPILLARY (II) CAPILLARY (III) TIP ..…… Pad Pitch Pad pitch x 1.3 ~ TIP Hole ..…. .Wire Diameter Wire diameter + 0.3~0.5 = H CD………Pad size/open/1st Ball CD + 0.4 ~ 0.6 = 1st Bond Ball size FA & OR….Pad pitch(um) FA >100 0,4 ~90/100 4,8,11 <90 11,15 IC type …… loop type pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead 2nd Search Height Search Speed 2 Search Tol 2 pad lead Search Speed 2 Search Tol 2 pad lead Search Speed 2 Search Tol 2 pad lead heat pad lead heat heat pad lead heat heat Formation of a second bondBase pad lead pad lead pad lead pad l