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力传感器为微电子封装应用程序-force sensors for microelectronic packaging applications.pdf 183页

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力传感器为微电子封装应用程序-force sensors for microelectronic packaging applications
microtechnology and mems microtechnology and mems Series Editor: H. Baltes H. Fujita D. Liepmann The series Microtechnology and MEMS comprises text books, monographs, and state-of-the-art reports in the very active field of microsystems and microtech- nology. Written by leading physicists and engineers, the books describe the basic science, device design, and applications. They will appeal to researchers, engineers, and advanced students. Mechanical Microsensors By M. Elwenspoek and R. Wiegerink CMOS Cantilever Sensor Systems Atomic Force Microscopy and Gas Sensing Applications By D. Lange, O. Brand, and H. Baltes Micromachines as Tools for Nanotechnology Editor: H. Fujita Modelling of Microfabrication Systems By R. Nassar and W. Dai Laser Diode Microsystems By H. Zappe Silicon Microchannel Heat Sinks Theories and Phenomena By L. Zhang, K.E. Goodson, and T.W. Kenny Shape Memory Microactuators By M. Kohl Force Sensors for Microelectronic Packaging Applications By J. Schwizer, M. Mayer and O. Brand J. Schwizer M. Mayer O. Brand Force Sensors for Microelectronic Packaging Applications With 149 Figures 123 ¨ Dr. Jurg Schwizer Professor Dr. Oliver Brand Infineon Technologies Georgia Institute of Technology P.O.Box 80 17 09 School of Electrical 81609 Munich, Germany and Computer Engineering Email: juerg.schwizer@infineon.com Atlanta GA 30332-0250, USA Professor Dr. Michael Mayer Email: oliver.brand@ece.gatech.edu University of Waterloo Centre for Advanced Materials Joining E3-2113 Waterloo Ontario N2L 3G1, Canada Email: mmayer@mecheng1.uwaterloo.ca Series Editors: Professor Dr. H. Baltes ETH Zürich, Physical Electronics Laboratory ETH Hoenggerberg, H

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