HSNT-6A封装的应用指引-SIISemiconductorCorporation.PDFVIP

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HSNT-6A封装的应用指引-SIISemiconductorCorporation.PDF

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HSNT-6A封装的应用指引-SIISemiconductorCorporation

CMOS IC应用手册 HSNT-6A封装的应用指南 Rev.2.0_01 © SII Semiconductor Corporation, 2009-2014 本手册以半导体安装技术人员为对象，记载了超小型封装HSNT-6A的特征、封装外形尺寸图、推荐焊盘、使用方法以及封装的标记规格和捆包规格。此外，作为参考数据，还记载了安装性能评价、信赖性测试结果和热敏电阻数据。关于本公司CMOS IC的品质保证系统、使用上的注意事项以及各产品的电气特性，请确认本公司的Web网站以及各产品的数据表。此外，推荐条件有可能因所使用的材料、条件及环境等因素的不同而需要改变。【对象封装】 • HSNT-6A 1 CMOS IC应用手册 HSNT-6A封装的应用指南 Rev.2.0_01 目录 1. HSNT-6A封装的特征 ·········································································································· 3 1. 1 HSNT-6A封装的概要 ·················································································································· 3 1. 2 HSNT-6A封装的外形尺寸图 ········································································································· 4 2. HSNT-6A封装的构成部件 ···································································································· 5 3. HSNT-6A封装的推荐焊盘尺寸以及焊剂印刷用推荐钢网开口尺寸 6 3. 1 推荐焊盘尺寸、推荐钢网开口尺寸 6 3. 2 HSNT-6A封装搭载位置 ··············································································································· 7 4. 使用及安装方法 ················································································································· 8 4. 1 保管方法 ······························································································································ ···· 8 4. 2 HSNT-6A封装的冲洗方法 ·························