[工学]Reflow defect analysis_4.pptVIP

Learning objectives/学习目的 1. Know the common defect 了解常见缺陷类型 ??2.Analysize the possible cause 分析可能的原因 ??3.Countermeasure for the defects 基于以上原因采取的对策 Tombstoning/ 立碑 Tombstoning/ 立碑 Tombstoning/ 立碑 Countermeasure/对策 3. Component terminal oxidization or contamination : Solderability test if necessary and RTV the defect material. 元件末端氧化或者受污染: 根据情况做可焊性实验并且退还缺陷物料. 4. Printing misalignment: adjust printing machine parameters. 丝印偏位: 校正丝印机的参数. 5. Placement misalignment: Optimize the PP machine parameters. 贴片偏位: 优化贴片机的参数. 6. Stencil aperture design issue: