【SMT资料】profile 对reflow制程的影响知识分享.pptVIP

Profile curve /sundae_meng *Flux softness point : Flux softness point will decrease solder paste viscosity. High heating rate Low heating rate Very low heating rate Viscosity Temperature /sundae_meng Preheating Zone : 1.Solvent evaporate completely 2.Flux activation and oxidation 3.Preheating time and temperature 3.1 For N2 oven the preheating time can be longer. 3.2 For Air oven the preheating time should shorter than N2 oven 4. PCB board bending control Before Preheating After Preheating PCB PCB /sundae_meng 5.Plastic BGA After Preheating .Plastic BGA PCB bending /sundae_meng Soaking Zone : *Homologous heating (PCB, Components and solder paste) *Solder paste viscosity control *Solder wetting and wicking begin. *Surface solder balls melting. Soaking Zone .Plastic BGA substrate (Tg :1750C) PCB bending /sundae_meng 1 2 3 2 Lead 1 Body 3 Pad Normal soldering Wicking Bridge by wicking More heat from the bottom Less heat from the top 2 Lead 1 Body 3 Pad 3 Pad≧ 2 Lead 1 Body Parameter setting : /sundae_meng Tombstoning : T1 T3 d T2 Condition which causes tombstoning shall be : T1 + T2 ＜T3 ?* In order to overcome the problem, the momentum relation must become as below ; ? T1 + T2 ＜T3 T1 + T2 ≧T3 T1 T3 d T2 Partial melting /sundae_meng *Peak temperature and Reflow time should be controlled *The flowing ability(surface tension) of solder (High Good) *Void formation *Component and / or board damage *N2 concentration Reflow Zone : /sundae_meng Cooling Zone : *Cooling down speed N2 concentration /sundae_meng 如何改善錫球 鋼板內距 0603 0.7 ~0.8mm 0808 1.1 ~1.2mm 12.6 1.95~2.1mm 鋼板形狀 /sundae_meng /sundae_meng Reflow後造成的坍塌 升溫速度過快 Soften Point Slump resistivity PAD間文字面的白漆，或Trace線 /sundae_meng 零件置放所造成的坍塌 放件衝程過大 膜厚過厚 鋼板厚度太厚 PCB背部支撐pin擺放位置不恰當 鋼板底部有貼貼紙 鋼板與PCB間隙過大 刮刀磨損 刮刀壓力太小 錫膏黏度太低 零件重量 /sundae_meng /sundae_meng /sundae_meng /sundae_meng 請注意，使用鞍狀流焊溫度曲線的目的在於確保得到良好的銲接點品質，而不必掛感零件尺寸大小和熱含量多寡，我們也已研發出特殊的抗垂流劑，可