二氧化硅包裹镓球的制备及其电子显微镜辐照研究-凝聚态物理专业论文.docxVIP

二氧化硅包裹镓球的制备及其电子显微镜辐照研究-凝聚态物理专业论文.docx

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二氧化硅包裹镓球的制备及其电子显微镜辐照研究-凝聚态物理专业论文

Abstract Microscale, submicron and nano materials exhibit chemical, good catalytic performance because they have many surface-atoms with many dangling bonds and unsaturated bond properties. Low melting point metal can reduce the target substance formation temperature greatly and energy consumption. We prepared microscale ~ submicron silica cover Ga particles by CVD in vertical frequency induction furnace, and nano scale metal Ga catalyst by electron beam irradiation in TEM. The main results are following: Get micro, submicron/nano scale gallium particles covered by silicain in vertical induction furnace by CVD, explain the growth mechanism . Various nanoscale Ga catalyst were fabricated via TEM electron-beam irradiation on microscale silica covered gallium balls. The results are the following: silica cover Ga particles and the pure Ga particles on the edge of C film will explode under electron beam irradiation, the diameter of the original ball is decreasing with the increasing of irradiation time, and the rate of the decreasing is diminishing; there are many new small pure Ga particles distribute around the original ball, their diameter is increasing until the explosion stop, the rate of increasing is decreasing, the farther from the original ball the smaller of the new Ga particle, and the smallest is about 5 nm. These results support that this explosion is a kind of Coulomb explosions. Analyze the factors about explosion on silica cover Ga ball under electron beam irradiation by a spherical core-shell structure model. the primary facts are the pressure caused by electron beam irradiation, theory combining strength of Ga and silica, and the surface tension of the Ga. Key words: Silica covered gallium particle TEM electron beam Irradiate Explosion Gallium particle 目 录 摘 要................................................................................................................ I Abstract...................................................................

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