La对Sn-Ag-Cu无铅钎料与铜钎焊接头金属间化合物的影响.PDF

18 9 2008 9 Vol.18 No.9 The Chinese Journal of Nonferrous Metals Sep. 2008 1004-0609(2008)09-1651-07 La Sn-Ag-Cu ( 410083) LaSn-3.0Ag-0.5Cu (IMC)Cu Sn 6 5 La 150 100 hCu SnCu Sn 3 6 5 Cu Sn Ag SnLa 6 5 3 (n)La AgAg3Sn Sn-Ag-Cu La TG 425.1 A Effect of La on intermetallic compounds of Sn-Ag-Cu lead-free alloy soldered with copper ZHOU Ying-chun, PAN Qing-lin, LI Wen-bin, LIANG Wen-jie, HE Yun-bin, LI Yun-chun, LU Cong-ge (School of Materials Science and Engineering, Central South University, Changsha 410083, China) Abstract: The effects of minor La on the formation and growth behaviors of intermetallic compounds at Sn-3.0Ag-0.5Cu lead-free solder alloy/copper substrate interface and inside the solders during soldering and aging were investigated. The results show that Cu Sn layer formed at the interface exhibits a continuous scallop-shaped structure after soldering, the 6 5 thickness of Cu Sn layer decreases with increasing La content. A thin Cu Sn intermetallic compounds layer forms at the 6 5 3 interface between Cu Sn layer and Cu substrate after aging at 150 for 100 h. Ag Sn particles are embedded to the 6 5 3 Cu6Sn5 layer. The total intermetallic compounds thickness increases with prolonging aging time, and decreases with increasing La content under the same aging condition. The time exponent (n) in growth kinetic of