合金元素对Sn-57Bi无铅钎料组织及韧性的影响-情报资料工作.PDF

Sn-57Bi 13 Sn- 57Bi Effect of Alloy Element on Microstructure and Impact T oughness of Sn-57Bi Lead-free Solders 1 1 3 1 , , , , ( 1 , 150001; , 518057; 3 , 518101) 1 1 3 1 HE Peng , LU Xiao-chun , ZHAN G Bin-bin , MA Xin , QIAN Yi-yu ( 1 State Key Lab of Advanced Welding Production T echnology, H arbin Institute of T echnology, Harbin 150001, China; ZTE Corporation, Shenzhen 518057, Guangdong, China; 3 Yik Shing Tat Industrial Co., Ltd., Shenzhen 518101, Guangdong, China) : Ag, Ge, Cu, Sb, Zn, Ce, P, Ni Sn-57Bi , , P, Ni Bi, , Ag Sn Ag, Ge, Zn, Cu 3 , Ag, Ge Sb, Ce, P, Ni , 43Sn-Bi- 1Ge- 1Ag : 43Sn-57Bi ; ; ; : T G 115. 8 : A : 1001-4381( 010) 10-0013-05 Abstract: The effect of Ag, Ge, Cu, Sb, Zn, Ce, P and Ni inclusions on melting temperature, w etta- bility, impact toughness and microstructure of 43Sn-57Bi lead-free solders w ere investigated. T he re- sult show ed that those inclusions had little influence on melting temperature of the solders. A ddition of P, Ni resulted in the appearance of Bi, w hich decreased the performance of solders. Ag3 Sn and zinc rich phase could increase the performance w hen the shape w as appropriate. Add Ag, Ge, Zn, Cu sole- ly could improve the solder. s ductility, w hile Sb, Ce, P, Ni could decrease the ductility