基于有限元的电感器线圈镀铜工艺仿真分析-表面技术.PDFVIP

第43卷摇 第5期 摇 摇 摇 表面技术 摇 摇 2014年10月 SURFACE TECHNOLOGY ·25 · 試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試試 基于有限元的电感器线圈镀铜工艺仿真分析 樊爱珍 (陕西工业职业技术学院,陕西 咸阳712000) 摘摇 要: 目的摇 优化电感器线圈电镀工艺,研究电感线圈电镀过程中电流、电解质电势和镀层厚度分布 规律。 方法摇 采用计算机仿真技术,基于电镀动力学、电化学理论、法拉第定理和移动网格理论,建立电 感线圈匝数参数化的三维电感器线圈电镀模型。 结果摇 电感线圈外部的铜离子浓度较高,大约为309 mol/ m 。 电感线圈最外圈的电镀厚度最厚,约7.3141 滋m。 线圈外部较大的电流导致电镀线圈外侧出现3 较大的沉积速率。 结论摇 电解的铜离子的质量传递是影响电镀动力学的最主要因素,线圈电镀层厚度与 电镀活性面上的电流分布相互作用。 该电镀模型可用于分析线圈匝数对电镀工艺的影响,优化设计类似 电镀工艺,研究电镀机理。 关键词:电镀动力学;移动网格;计算机仿真;电镀模型 中图分类号:TG153.1;TP391.9摇 摇 摇 文献标识码:A摇 摇 摇 文章编号:1001鄄3660(2014)05鄄0025鄄04 Simulation Analysis of Copper Electroplating of Inductor Coils Based on Finite Element FANAi鄄zhen (Shaanxi Industrial Vocational College,Xianyang712000,China) ABSTRACT:Objective To optimize the electroplatingprocessof the inductor coil and study the current distribution,the electro鄄 lyte potential and the coating thickness distribution during the electroplating process of the inductor coil. Methods The computer simulation technology was used to build a three鄄dimensional inductor coil plating model with regards to parameterized coil turns based on plating kinetics,electrochemistrytheory,Faradaytheorem,andmovingmeshmodel. ResultsTheexternalpart of induc鄄 3 tor had a high copper concentration of about 309 mol/ m ;the outermost plating inductor coil had the highest thickness of about 7.3141 滋m;the larger current in the external coil resulted in a larger plating deposition rate for the outer coil. Conclusion The mass transfer of electrolytic copper ion has the main effect on the plating kinetics. The plating thickne