铜箔表面钝化处理工艺.docVIP

一种新型环保铜箔表面钝化处理工艺研究 黄永发1，王艳2，赖学根3，李立清2，唐云志2* （1.江西省 江铜-耶兹铜箔有限公司，江西 南昌 330034；2.江西理工大学冶金与化学工程学院，江西 赣州 341000； 3. 江西铜业高级技工学校，江西 贵溪 335400） 摘 要: 为了取代现有铜箔钝化工艺中有毒物质六价铬的使用，本文以钼酸钠、植酸等作为新型添加剂，对经过“粗化——固化”处理后的铜箔直接进行钝化实验，探讨了钼酸钠、磷酸钠、氧化锌等添加剂含量和电流密度、钝化时间及植酸存在等单因素条件变化对钝化膜的影响，得出最佳工艺参数为：钼酸钠 8 g/L，磷酸钠 4 g/L，氧化锌 3 g/L，植酸 2 ml/L，钝化时间 10 s，电流密度 0.2 A/dm2。在最佳工艺下，得到的铜箔钝化膜表面平整均匀、质量较好，通过抗氧化试验和盐雾试验后，该铜箔表面无任何缺陷，未出现氧化、腐蚀现象，展现出较理想的抗氧化能力和抗腐蚀能力，具有良好的应用前景。 关键词: 铜箔；表面钝化；钼酸钠；添加剂 中图分类号： 文献标识码：A A research on environmental protection surface passivation new technology of copper foil HUANG Yongfa1, WANG Yan2, LAI Xuegen3, LI Liqing2, TANG Yunzhi2* (1. Jiangxi Copper-Yates Foil Incorporated, Nanchang, 330034, China; 2. School of Materials and Chemical Engineering, Jiangxi University of Science and Technology, Ganzhou 341000, China; 3. Jiangxi Copper Industry Senior Technical School, Guixi, 335400, China) —————————————————————— 基金项目：国家自然科学基金资助项目；江西省青年科学家人才基金和江西省教育厅基金（GJJ11453） 作者简介：黄永发（1968-），男，在读硕士，高级工程师；研究方向：电解铜箔，EMAIL:tangyunzhi75@163.com Abstract: In order to replace the poisonous hexavalent chromium in the passivation treatment technology of copper foil, a new passivation treatment technology was studied by using sodium molybdate and phytic acid as additives. The passivation treatment experiment was conducted directly to the copper foil that had been treated by coarsening and curing disposition. The effects of the passivation coating were explored by changing the content of sodium molybdate, sodium phosphate, zinc oxide and the experimental conditions of current density, time and e of phytic acid. The optimization process parameters were shown as follows, sodium molybdate 8 g/L, zinc oxide 3 g/L, sodium phosphate 4 g/L, phytic acid 2 ml/L, current density 0.2 A/dm2, passivation time 10s. The copper foil with good quality obtained under the optimal condition was well-distributed. More importantly, the copper foil had no drawbacks after the antioxidative experiment