无铅焊膏回流焊工艺曲线参数的优化选择.docxVIP

无铅焊膏回流焊工艺曲线参数的优化选择 温桂琛 1，雷永平 1，林 健 1，刘保全 2，白海龙 2，秦俊虎 2 （1. 北京工业大学 材料科学与工程学院，北京 100124；2. 云南锡业锡材有限公司，云南 昆明 650217） 摘要: 通过无铅焊膏的回流焊工艺窗口实验和工艺参数正交实验，分析了升温速率、峰值温度和熔点以上驻留 时间对焊点形态的影响，确定了自制 SAC305 焊膏的合适工艺窗口和推荐工艺曲线参数。结果表明，自制焊膏的合 适工艺窗口为峰值温度在焊料熔点以上 20~30 ℃，熔点以上驻留时间 60~80 s，长 360 cm，宽 30 cm 的铁丝网型传 送带速度为 28 Hz。温区设定温度分别为 190，210，230，260，285，300，280，265 ℃，这为工程实践中同类无铅 焊膏的相关工艺制定提供了参考。 关键词: SAC305 焊膏；回流曲线；工艺参数；峰值温度；熔点；正交实验 doi: 10.3969/j.issn.1001-2028.2014.01.014 中图分类号: TG425 文献标识码:A 文章编号:1001-2028（2014）01-0052-04 Optimization and selection of lead-free solder paste reflow process profile parameters WEN Guichen1, LEI Yongping1, LIN Jian1, LIU Baoquan2, BAI Hailong2, QIN Junhu2 (1. College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China; 2. Yunnan Tin Material Co., Ltd, Kunming 650217, China) Abstract: The influences of heating rate, peak temperature and dwelling time above the melting point on the solder joint shape were analyzed, and the appropriate process interval and recommended process profile of self-made SAC305 solder paste were determined by process interval experiments and parameters orthogonal experiments. Results show that the parameters of appropriate process interval of self-made solder paste are: the peak temperature of 20－30 ℃ above the melting point of the solder, the dwelling time above the melting point of 60~80 s, the transmission belt speed is 28 Hz, which is barbed wire type with a length of 360 cm and width of 30 cm. The temperatures of heating zones were set as 190, 210, 230, 260, 285, 300, 280, 265 ℃. These parameters could provide references for the process of other similar lead-free solder pastes in engineering practice. Key words: SAC305 solder paste; reflow profile; process parameter; peak temperature; melting point; orthogonal experiment 回流焊是电子组装工艺中的重要环节。即让贴 装好元器件的电路板进入回流焊设备，通过加热电 路板使焊膏熔化后冷却，实现元器件与印制电路板 之间的互连[1]。回流焊过程中最重要的就是回流工艺 曲线的确定，无论应用何种体系的钎料，如果没有 合适的回流工艺曲线，也