cam简介(中英对照).docVIP

PAGE PAGE PAGE 1 CAM 簡 介( CAM profile) 一﹑工程資料制作流程簡介(Engineering data making flow profile) Engineering data making flow chart Engineering data making flow chart 二﹑本司目前擁有Genesis2000 V8.0 ﹑CAM350 V7.5.1﹑ View2001 V3.04等CAM軟件。 可解讀RS-274-D及RS-274-X之GBR資料和ODB++格式之資料。 CAM software such as Genesis2000 V8.0, CAM350 V7.5.1, View2001 V3.04 etc are used in our company, which can decode the GBR data of RS-274-D and RS-274-X as well as ODB++ format data. 三﹑本司建議客戶提供RS-274-X或ODB++格式之資料及相應的PCB制作規范及檢驗規范。若無法提供﹐我們將按公司一般制作方式處理。為了節省雙方的資料確認時間﹐建議客戶每個料號附一份PCB制作規格表。 Suggest the customers provide the RS-274-X or ODB++ format data, as well as the corresponding PCB Manufacturing Spec and inspection Spec. Otherwise, we will deal with it in general way. A PCB manufacturing Spec table will be necessary appended for each part in order to save times of data confirming. Usual problems and solving method of GBR file Usual problems and solving method of GBR file PCB Spec table PCB Spec table 四﹑GBR轉換為ODB++格式。(Transform the GBR into ODB++ format.) Genesis2000 operation steps Genesis2000 operation steps 五﹑CAM處理(CAM processing.) 鑽孔文件處理(Drilling file processing) 2 內層處理(Inner layer processing) 2.1 內層Thermal PAD直徑小于成品孔徑情形﹐保持原稿不變。內層Thermal PAD直徑大于成品孔徑﹐開口不夠8mil﹐將開口放大8mil以上(含8mil)﹔開口大于8mil之情形﹐保持與原稿一樣。在考慮到保証足夠通道的前提下﹐可將角度調整﹐客戶有特別要求之情形﹐按特別要求處理。 For Thermal PAD diameter of inner layer less than final product size, keep the artwork in no change. For Thermal PAD diameter of inner layer more than final product hole size and the placket 8mil below, then magnify the placket 8mil(included) above; besides it, if the placket 8mils above, keeps it the same as artwork. Under the insurance of sufficient passages, angle may adjust, when special requirement appeared by customer, deal with per it. 2.2 內層實心PAD必須比成品孔徑單邊放大至少12mil以上(含12mil)。 (直接量產客戶設計小于12mil之情形﹐全部放大到12mil.) Each edge of solid inner layer PAD must be magnified above 12