住友LCP完全技术手册.doc

Sumikasuper LCP Technical Seminar <contents> 1. Improvement of the warpage 1-1. Introduction 1 1-2. Theoretical background of the warpage problem 1 1-3. Experimental analysis 2 1-4. Case study board to board connector (0.5 mm pitch) 2 S/O DIMM 3 PGA socket 4 2. High-speed injection molding 2-1. Introduction 6 2-2. Thin-wall fluidity of LCP and characteristic of injection molding machine Experiment 6 Results 7 3. Reduction of the blister at soldering 3-1. Introduction 9 3-2. Retention of resin at the inside of injection machine 9 3-3. Temperature settings of injection machine 10 3-4. Relation between retention of LCP in cylinder and blister 12 3-5. Other possibilities Effect of moisture 13 Dragging the air into the melt 14 Unbalance between cylinder size and molding volume 14 3-6. Conclusion 16 Purging method of Sumikasuper LCP 17 4. Reduction of the bubble after molding 4-1. Introduction 18 4-2. Comparison between "the bubble" and "the blister" 18 4-3. Reduction of the bubble Suitable injection condition 18 Suitable cavity design 19 5. Improving the hole strength during inserting contact pins 5-1. Introduction 21 5-2. Case study 21 1 Improvement of the warpage 1-1. Introduction The liquid crystalline polymers (LCPs) are widely used as many types of electric and electronics parts because of their superiorities in heat resistance, soldering resistance, high-temperature strength, chemical resistance, thin-wall fluidity, etc. Especially, LCPs exhibit excellent thin-wall fluidity and moldability among any other engineering plastics. However, to mold the products which have many thin-wall portions and complicated 3-D shape as connectors requires somehows based on the specific characteristics of the LCP. In this section, we would like to consider how to reduce the warpage of connectors molded by LCPs. 1-2. The