溅射镀膜原理及其应用 46页PPT文档.pptVIP

磁控溅射镀膜及其应用;溅射原理;溅射原理;溅射原理;溅射原理;溅射原理;溅射原理;溅射原理;磁控溅射原理;磁控溅射原理;磁控溅射原理;磁控溅射原理;磁控溅射原理;溅射靶材;溅射靶材;溅射靶材;溅射靶材;靶材冷却与靶背板;靶材与背板的连接;磁控靶常用的永磁材料;靶材制备工艺;靶材质量对镀膜的影响;离子源;离子源;磁控溅射常见技术;磁控溅射常见技术;磁控溅射常见技术;磁控溅射常见技术;High target utilization sputtering (HiTUS) technologySputtering is generally the preferred option for coating technologies. Both conventionalmagnetron and ion beam sputtering have limitations regarding the deposition rate control.Magnetron sputtering in particular is also inefficient in terms of target utilization and does not allowsputtering from thick ferromagnetic targets. The sputtering technology described in this paperprovides control of grain size, high uniform target utilization ( 90%) and the ability to sputterferromagnetic materials efficiently with close control of deposition rates [12] (see alsoplasmaquest.co.uk). The system is based on a remotely generated high intensity plasma asshown in Fig. 1 and consists of a side arm launch tube as a plasma source linked to the maindeposition chamber. The plasma is generated in the side arm by an RF electric field (max. 2.5 kW).Energy is transferred to the plasma by electrons via the mechanism of Landau damping. The plasmais then launched into the chamber via the interaction of the RF field with the launch electromagnetand then steered onto the target by a second electromagnet.;磁控溅射常见问题;溅射镀膜的步骤;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用;磁控溅射工业应用; Thank you!;谢谢你的阅读