电子封装互连方法课件chapter3_bonding_materials.pdf

Interconnection Technology In Electronic Packaging (Chapter 3. Bonding Materials) Hongjun JI Ph.D/Assistant Prof. School of Materials Science and Engineering < Interconnection Technology in Electronic Packaging > By Hongjun JI <Email:jhj7005@hit.edu.cn> October 10, 2011 Contents • Bond wire material requirements and properties • Choice of material • Wire manufacturing • Quality of bondwire • Testing methods and specifications Au Al Cu 2 < Interconnection Technology in Electronic Packaging > By Hongjun JI <Email:jhj7005@hit.edu.cn> October 10, 2011 Overview on bonding wire • Yields of wire bonding process must approach 100 percent • Consistent productivity • To satisfy the ultra fine pitch applications, the bond-wire geometry has very low loop, very short loop, and use very thin wire • High power IC applications also demand high current carrying capability and high fatigue resistance • Long term reliability requirements of the IC device demand that the wire must ensu igh mechanical strength and corrosion resistance in harsh environments 3 < Interconnection Technology in Electronic Packaging > By Hongjun JI <Email:jhj7005@hit.edu.cn> October 10, 2011 Overview on bonding wire • The wire selection for any particular application depends on the chip metallization, package design, package construction and bonding machine configuration. Selec