HDI印刷线路板流程介绍.pptxVIP

HDI Manufacturing Process FlowMechanical drillingPre-engineeringCu platingPattern imagingPattern imagingEtchingSolder MaskLaminatingSurface FinishedDrillingCu platingRoutingHole pluggingElectric testPattern imagingVisual inspectionShippingLaminationLaser AblationPre-engineeringPattern imagingEtchingLaminatingDrillingDesmearCu platingHole pluggingBelt SandingCu platingPattern imagingLaminationLaser AblationMechanical drillingCu platingPattern imagingSolder MaskGold platingRoutingElectrical testVisual inspectionHole counterShipping* Raw material (Thin Core,Copper,Prepreg…...)Raw Material: FR-4 (Difuntional,Tetrafuntional)Supplier: EMC ,Nan-YaSheet size : 36”*48” , 40”*48” ,42”*48Core Thickness : 0.003”,0.004”,0.005”,0.006” 0.008”,0.010”,0.012”,0.015” 0.021”,0.031”,0.039”,0.047”Copper Foil: 1/3 oz,1/2 oz,1.0 oz,2 ozPrepreg type: 1080,2113,2116,1506,7628,7630COPPER FOIL1.內層基板 (THIN CORE)LaminateCopper FoilEpoxy Glass裁板(Panel Size) 2.內層線路製作(壓膜) (Dry Film Resist Coat)Etch Photoresist (D/F)Photo Resist3. 內層線路製作(曝光)(Expose)Artwork(底片)A/WArtwork(底片)Photo ResistBefore ExposeAfter ExposePhoto Resist4. 內層線路製作(顯影)(Develop)Photo Resist5. 內層線路製作(蝕刻)(Etch)6. 內層線路製作(去膜)(Strip Resist)7.黑氧化 ( Oxide Coating)Copper FoilLAYER 1LAYER 2Prepreg(膠片)LAYER 3Inner LayerLAYER 4Layer 1Prepreg(膠片)LAYER 5Copper FoilLayer 2LAYER 6Layer 3Layer 48. 疊板 (Lay-up)9. 壓合 (Lamination)典型之多層板疊板及壓合結構壓合機之熱板疊合用之鋼板COPPER FOIL 0.5 OZCOMPprepreg Thin Core ,FR-4prepreg Thin Core ,FR-4prepreg S0LD.COPPER FOIL 0.5 OZ...疊合用之鋼板10-12層疊合疊合用之鋼板COPPER FOIL 0.5 OZCOMPprepreg Thin Core ,FR-4prepreg Thin Core ,FR-4prepreg S0LD.COPPER FOIL 0.5 OZ疊合用之鋼板壓合機之熱板鋁板墊木板10. 鑽孔 (Drilling)11. 電鍍Desmear Copper Deposition12. 塞孔(Hole Plugging)13. 去溢膠 (Belt Sanding)14. 減銅 (Copper Reduction) → Option15. 去溢膠 (Belt Sanding) → OptionPhoto Resist16. 外層壓膜 Dry Film Lamination (Outer layer)UV光源17. 外層曝光 Expose18. After Exposed19. 外層顯影 Develop20. 蝕刻 Etch20. 去乾膜 Strip ResistRCC(Resin Coated Copper foil)21.壓合 (Build-up Layer Lamination)Dry Film(乾膜)Dry