半导体封装流程完整PPT课件.pptxVIP

Introduction of IC Assembly ProcessIC封装工艺简介;Introduction of IC Assembly Process;半导体封装的目的及作用;半导体封装的目的及作用;IC Process Flow;IC Package （IC的封装形式）;IC Package （IC的封装形式）;IC Package （IC的封装形式）;IC Package （IC的封装形式）;IC Package （IC的封装形式）;IC Package Structure（IC结构图）;Raw Material in Assembly(封装原材料);Raw Material in Assembly(封装原材料);Raw Material in Assembly(封装原材料);Raw Material in Assembly(封装原材料);Raw Material in Assembly(封装原材料);Typical Assembly Process Flow;FOL– Front of Line前段工艺;FOL– Back Grinding磨片;FOL– Wafer Saw晶圆切割;FOL– Wafer Saw晶圆切割;FOL– 2nd Optical Inspection二光检查;FOL– Die Attach 芯片粘接;第一步：顶针从蓝膜下面将芯片往上顶、同时