集成电路封装基板工艺.pptx

集成电路封装基板工艺 封装基板简介基板正在成为封装领域一个重要的和发展迅速的行业，国内现在的基板主要依靠进口，如日韩以及台湾地区等等。2 ITRS中关于基板技术的描述3? International Technology Roadmap for Semiconductors， 2005Edition， Assembly and Packaging– Assembly and Packaging Difficult Challenges – Near-term– Assembly and Packaging Difficult Challenges – Long-term– Package substrates are both the most expensive component of most packages and the factor limiting package performance. The technology of package substrates will need to be expanded in several areas if the cost and performance projections of the Roadmap are to be met. 基板【互连类型】 基板互连如何实现？ 基板互连【多层陶瓷基板】 多层陶瓷基板Stacked Via Structure 多层陶瓷基板Cordierite Glass-Ceramic/Cu Substrate（70层） 多层陶瓷基板技术9 基板互连【微孔叠压基板】 基板互连【微孔叠压基板】流程 BGA及CSP有机基板工艺12 内层引线图形化13 内层规则14 钻孔15 层间互连---Dog Bone16 外层引线图形化17 阻焊膜（绿油）18 双面PBGA基板的制造流程19 双面PBGA基板的制造流程20 双面PBGA基板的制造流程21UV显影 双面PBGA基板的制造流程22 加成法4层（1/2/1）基板工艺23 减成法4层（1/2/1）基板工艺24 多层PBGA基板6层PBGA基板结构示意图25 高密度BGA基板互连技术26机械钻孔破坏多层基板内层线路完整性，导致不必要的寄生电容等大孔径将占据元件组装面积、减小布线面积，不利于高密度封装受机械钻孔能力的限制，导致成本的升高电镀能力的限制（高的深宽比） 积层（增层）法基板的制造27 积层技术的提出与引入传统多层镀通孔PCB中，板上超过50%的面积用于通孔及相关焊盘。盲孔和埋孔技术是一个发展阶段。通过控制钻孔深度及层压技术。积层技术引入，对于HDI（High Density Interconnect）基板特别有意义。28 ITRS的描述The invention of build-up technology introduced redistribution layers on top of cores. While the build-up layers employed fine line technology and blind vias, the cores essentially continued to use printed wiring board technology with shrinking hole diameters.The next step in the evolution of substrates was to develop high density cores where via diameters were shrunk to the same scale as the blind vias i.e. 50 μm.The full advantage of the dense core technology is realized when lines and spaces are reduced to 25 μm or less. Thin photo resists (<15 μm) and high adhesion, low profile copper foils are essential to achieve such resolution.In parallel coreless substrate technologies are being developed. One of the more common approaches is to form vias in a sheet of dielectric material and to fill the vias with a metal paste to form