PCB专业分析和总结.docx

PCBPrinted Circuit Board

PCB

A1.Process流程BoardCut开料→Drill钻孔→IncomingQualityControl(IQC)→PlatedThroughHole

A1.Process流程

thetypeofholes孔的类型PanelPlating整板镀铜→dryfilm干膜→patternplating图形电镀→FlashGoldPlating闪金电镀Cu(Copper)/Sn(Tin)Plating→etch蚀刻→qualitycontrol(FIRST)QC→WetfilmW/F→Legend(MarkPrinting,ComponentMark)文字→HotAirLeveling喷锡(ImmersionGold,ChemicalGold沉金)→Routing锣板(Punching啤板)→V-Cut→Rinse洗板→E-test→Entek→FinalQualityControlFQC→QAAudit审核

thetypeofholes孔的类型

B

Bdrillprocess

Viahole通孔 Componenthole元件孔 Installinghole

安装孔 Registrationhole(forPrinting,HAL,Chemicalgoldetc)定位孔 Slot 槽孔 PTHhole电镀孔 NPTHhole非电镀孔 Bighole(Toobigtotent孔太大,不能掩孔) Smallhole小孔

DrillprocessBoardcut开料→Pinholemaking销钉孔(Registrationpin)→Boardup上板→

Drillprocess

Parameters参数Drilling→Boarddown→Check

Parameters参数

Quality品质 DrillBit钻咀Diameterofhole(drillbit)孔径Feedspeed进刀速度RPM(Roundperminute)转速Howmanypanels(Totalthickness厚度)上板数量Holequantity

Quality品质

CMaincontentsIQC（IQC主要内容） aboutdrillbit关于钻咀chips缺口overlap重合gap间隙flair变形abouthole关于孔rough(roughness)粗糙度burrs(deburr)去毛刺nailheading钉头(multilayer多层板)resinsmear(desmear)除胶渣surfacescratch表面擦花breakoutofregistrationhole定位孔爆holeshift偏孔(位)holeplugged堵孔rawmaterial材料Laminate板材

C

Maincontents

IQC（IQC主要内容）

Measuringtooling测量工具Pingauge针规 Caliper

Measuringtooling测量工具

C-caliper螺旋卡尺 X-rayinstrumentforAu/Nithickness X光金/镍测厚仪 OutlineArtworkforoutlinedimension

2.Themainrawmaterials主要材料外形菲林Visual

2.Themainrawmaterials主要材料

copperfoil铜箔 chemical化学药品 dryfilm wetfilm Pb(lead)/Sn(Tin)Alloymixtureofmetals铅锡合金

flux松香 etchsalt蚀板盐 carbonink碳油 legendink字符油墨 die模具 Semifinished

3.Qualityoflaminate板材品质productsformsub-contractor 外协厂 Pinhole针孔

3.Qualityoflaminate板材品质

delamination分层 whitespot白点 fibreexposure露纤维 di