FPC工艺流程培训教材_(NXPowerLite).ppt

The End FPC工艺流程培训 ZASTRON ELECTRONIC (SHENZHEN) COMPANY Ltd. Department：PE/FPC Division Agenda FPC Advantages FPC Structure Production process 3D 立体构装与耐曲绕动态设计 (FPC could apply on 3D package dynamic flexible design) 软板可依空间改变形状做立体配线构装 FPC allows three-dimension assembly can fit variety outer case sizing. 软板具有高度曲绕、动态摆动之可行性 FPC has high flexibility and dynamic moving capability. FPC Advantages 软板重量轻，体积薄，适合手持式携带型产品设计趋势 FPC make devices smaller ; thinner ; shorter lighter. 轻、薄、短、小的高密度线路配布 (Light/Thin/Short/Small high density routing assembly) 软板线路可符合高密度配布，最小线宽／线距1mil / 1mil (间隔 0.05 mm) FPC could fit high routing density demands for 1/1 mil lines and spaces.( pitch 0.05 mm ) FPC Advantages 软板可进行零件表面贴装与连接器互连，达到组装容易，维修便利，高信赖度 FPC can do the SMD and connector assembly easily and benefit for repair and high reliability. 卷式生产与良好的组装信赖度 (Roll to roll manufacturing and high assembly reliability) 软板生产方式可自动化连续性卷带式生产 Reel to reel continuous production is possible for FPC manufacturing. FPC Advantages FPC Structure Copper Foil Polyimide Plating Cover lay 单面板(Single Side) 使用单面板之基材于电路形成后，加上一层覆盖膜，成为一种最基本的软性电路板 Applied with single sided material to make pattern and cover the cover layer on it, that’s the simplest flexible boards. FPC Structure 双面板(Double Side) Cover lay Copper Foil Polyimide Plating 使用双面板之基材，于双面电路成形后，分別在各面加上一层覆盖膜，成为另一种基本电路板 Applied with double sided material to make pattern on both side then add on cover layer on each side , that’s the double sided flexible boards. 开料(Cutting): 基材铜箔都是以滚筒的形式包装，首先要将这些滚筒形式包装的铜箔按照客户需求的尺寸或根据产品的设计或布局裁切成适当的大小。 基材：铜箔——根据其用处分为单面铜箔、双面铜箔，根据其生产工艺特性分为RA铜和ED铜。RA铜指用压展方法得到的铜箔，ED铜指用电镀方法得到铜箔。 FPC Production process Cutting Roll Sheet 1.开料 3.黑孔 4.镀铜 5.贴干膜 6.LDI曝光 7.DES 9.覆盖膜 8.AOI 10.电镀镍金 11.丝印阻焊 12.贴补强板 13.成型1 14.O/S测试 15.成型2 2.钻孔 16.FQC 17.包装 2. 钻孔(Drilling): 利用机械式钻针高速旋转钻透之方式，將基材依设计程式钻成通孔 设计孔的种类有下列 导通孔(Via Hole) 零件孔 定位孔或工具孔 FPC Production process 机械钻孔 机械钻孔 1.开料 3.黑孔 4.镀铜 5.贴干膜 6.LDI曝光 7.DES 9.覆盖膜 8.AOI 10.电镀镍金 11.丝印阻焊 12.贴补强板 13.成型1 14.O/S测试 15.成型