W-Cu触头材料微波烧结.pdf

第 40 卷第 3 期 中南大学学报( 自然科学版) Vol.40 No.3 2009 年 6 月 Journal of Central South University (Science and Technology) Jun. 2009 W-Cu 触头材料的微波烧结 郭颖利，易健宏，罗述东，彭元东，李丽娅 ( 中南大学 粉末冶金国家重点实验室，湖南 长沙，410083) 摘 要：采用微波烧结技术制备 W-25Cu 触头材料，并与常规烧结进行对比。结果表明：微波烧结升温速度 快，周期短，能促进 W-Cu 材料的致密化；在适当条件下，微波烧结能获得相对密度达 99.8% 的 W-Cu 样品；微 波烧结能改善 W-Cu 样品中两相分布的均匀性和 W 晶粒尺寸的一致性，但引起W 晶粒的快速长大；Fe 烧结助剂 导致 W-Cu 材料显微组织均匀性变差，并引起晶粒进一步粗化；微波烧结技术能够应用于 W-Cu 材料的制备，在 缩短生产周期、降低生产成本方面具有潜在优势。 关键词：微波烧结；W-Cu 触头材料；致密化；显微组织 中图分类号：TF124.5; TG146.4 文献标识码：A 文章编号：1672−7207(2009)03−0670−06 Microwave sintering of W-Cu contact materials GUO Ying-li, YI Jian-hong, LUO Shu-dong, PENG Yuan-dong, LI Li-ya (State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China) Abstract: Microwave sintering of W-25Cu composites was presented, along with conventional sintering for a comparison. The experimental results show that microwave sintering promotes the densification of green compacts with higher heating rate and reduced sintering cycle. The sintered relative density of 99.8% can be achieved during microwave processing under appropriate conditions. In addition, microwave sintering improves the uniformity and homogenization of W grain size, and yet leads to growth of W grain. Fe sintering aid degrades the microstructure uniformity and further coarsens W grains. The present investigation demonstrates the feasibility of applying microwave sintering technique to consolidate W-Cu composites and its promising outlook in reducing production cycle and cost. Key words: microwave sintering; W-Cu contact materials; densification; micros