集群磁流变效应微磨头平面研抛加工技术研究.pdfVIP

Development of a new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on magnetorheological effect∗ Yan Qiusheng, Tang Aijun, Lu Jiabin, Gao Weiqiang Faculty of Electromechanical Engineering ，Guangdong University of Technology，Guangzhou (510090) E-mail ：qsyan@ Abstract A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented in this paper, and some experiments were conducted to prove its effectiveness and applicability. Under certain experimental condition, the material removal rate was improved by a factor of 20.84% as compared with the conventional polishing methods with dissociative abrasive particles, while the surface roughness of the workpiece was not obviously increased. Furthermore, the composite of the MR fluid was optimized to obtain the best polishing performance. On the basis of the experimental results, the material removal model of the new plate polishing technique was presented. Keywords: Tiny-grinding wheel cluster, Magnetorheological effect, Plate polishing, Material removal model 1. Introduction With the development of optoelectronic technique, there is an increasing demand for ultra smooth plate polishing. The optical elements made of optical glass, resin materials or other materials, such as optical glasses, display screen and silicon wafers, need high surface precision and shape accuracy. Lapping or polishing is one of final effective machining methods. To polish the workpiece with dissociative abrasive particles, the key to im