晶粒尺寸对冷轧退火纯Cu晶界特征分布的影响.pdfVIP

46 7 Vol.46 No.7 2010 7 769—774 ACTA METALLURGICA SINICA Jul. 2010 pp.769–774 Cu ∗ (, 255049) (, 255049) (EBSD) Cu (GBCD). , ( 12 µm) 75.7% Σ3n (n=1, 2, 3) , Σ3n (n=1, 2, 3) , 200 µm, GBCD ; , , Æ. EBSD (twin filtering) (FPM) , (triple junctions) Σ3 , Σ3 GBCD , , Æ GBCD . Cu, , , TG111 A Æ 0412−1961(2010)07−0769−06 EFFECT OF GRAIN SIZE ON THE GRAIN BOUNDARY CHARACTER DISTRIBUTIONS OF COLD ROLLED AND ANNEALED PURE COPPER CAI Zhengxu, WANG Weiguo, FANG Xiaoying School of Mechanical Engineering, Shandong University of Technology, Zibo 255049 GUO Hong Center of Testing and Analysis, Shandong University of Technology, Zibo 255049 Correspondent: WANG Weiguo, professor, Tel: (0533)2786835, E-mail: wang.wei.guo@163.com Supported by Nature Science Foundation of China (Nos and Manuscript received 2010–02–06, in revised form 2010–04–20 ABSTRACT Pure copper (99.97%) samples with varied grain sizes were cold rolled and annealed at first and then their grain boundary character distributions (GBCDs) were characterized by electron back scatter diffraction (EBSD) techniques. The results showed that the sample with finer initial grain size (12 μm) appeared to be largely populated by the so-called special boundaries such as Σ3n (n=1, 2, 3) after cold rolling and annealing, the fraction of Σ3n boundaries reached 75.7% and the averaged size of clusters of grains with Σ3n (n=