功率型LED封装中的热阻分析.pdfVIP

5 6 2009 12 30 6 : LED LED 1 1 1, 2 刘洪涛 , 钱可元 , 罗 毅 ( 1. , 518055; 2. , 100084) : LED , LED , , : LED; ; : TN312. 8 : A : 1001- 5868(2009)06- 0831- 04 Analysis and Measurement of T ermal Resistance Induced by LED Bonding 1 1 1, 2 LIU Ho g2tao , QIAN Ke2yua , LUO Yi ( 1. Graduate Sc ool at S enz en, Tsing ua Univer sity, S enz en 518055, CHN; 2. State Key Laboratory on Integrated Optoelectronics, Department of Electronic Engineering, Tsing ua Univer sity, Beij ing 100084, CHN) Abstr act: The LED chip bo di g is a esse tial tech ology to reduce the thermal resista ce of LED. Thermal performa ce of bo di g materials such as Ag2epoxy resi was a alyzed usi g heat tra sfer tools. For the sake of assessi g the bo di g tech ology, a method of measur i g the thermal resista ce i duced by bo di g process was proposed for the first time based o the forward worki g voltage method. It is show that the theor etical simulatio results agreed well with the measured results. Key words: power LED; ju ctio temperature; thermal resista ce of bo di g 0 , , LED , LED [324] , LED [ 1] , LED , LED ( [2] ) , , 1 , LED , , [5] , :2009- 01- 0