低温_高速_高稳定性化学镀镍研究进展.pdfVIP

37 6 2008 12 Vol. 37 No. 6 Dec. 2008 SURFACE TECHNOLOGY 81 , , , (, 050003) [ ] N i-P非晶态合金镀层作为一种功能镀层, 具有优良的电磁屏蔽静电防护性能以及优良的物理化 性能以往研 究较多的是在酸性镀液中进行的化 镀沉积 N i-P非晶态合金镀层, 温度一般较高, 使化 镀的应用受到了限制, 尤其是对塑料等非 金属材料的表面金属化因此, 低温高速化 镀越来越受到科研工作者的重视同时, 镀液的稳定性是化 镀能否顺利施镀以及 降低化 镀成本的重要因素鉴于此, 在对国内外低温高沉积速度化 镀镍及镀液稳定性方面的研究进行总结的基础上, 展望了 化 镀镍研究领域的发展方向 [] 化 镀镍; 非晶态合金; 低温; 高速; 镀液稳定性; 电磁屏蔽 [] TQ 153. 1 [] A [] 100 1- 3660( 2008) 06- 0081- 03 The Pro ress of Study on Low-temperature, H i h-speed and H i h Stability Chem ical Platin ZHAN G Yong, AN Zheng-tao, YAN Jun, X IE Jun-le i (O rdnance Engineering C llege, Shijiazhuang 050003, China) [Abstract] N i-P am rph us all y cladd ing p ssesses the fine electr m agnetism and static electricity pr tective perf rm ance as a k ind f functi n cladd ing materia,l as w ell as the fine physical chem istry functi n. Currently, many study ad pts the acid ic p lating s luti n, the temperature is upper, s the app licati n f chem ical p lating is lmi ited, espe- cially chem ical plating n the surface f p lastic. S , chem ical plating under the c nditi n f l w temperature and h igh speed is regarded by investigat r; smi u ltane usly, the stab ility f plating s luti n is mi p rtant fact r thatw hether chem -i cal plating can successfu l r n t, and reduce the c st f chem ical p lating. The research f chem ical p lating n ickel in lw temperature and high speed and p lating s luti n stab ility w as summ arized, and the devel pmen t d irecti n f chem ical plating nickelw as view ed [K ey words] Chem ical p lating n icke;l Am rph us all y; L w-temperature; H igh-speed; Plating s luti n stabil-i ty; E lectr magnetic sh ield