钼铜材料制备技术研究进展.pdfVIP

34 5 Vol134 No15 2010 10 CH INA MOLYBDENUM INDUSTRY October 2010 李来平, 林小辉, 梁 静 (, 71001 ) : M o/Cu, , , , Mo /Cu , , M o/Cu , Mo /Cu : M o- Cu; ; + : TG139 . 5 : A : 100 - 2 02( 2010) 05- 004 1- 0 THE PROGRESS IN PREPARATION TECHNIQUE OF MOLYBDENUM - COPPER COMPOSITES LI Lai- ping, LIN X iao- hui, LIANG Jing ( Northw est Institute ForN on- ferrousM etalResearch, X ian 71001 , Shaanx,i Ch ina) Abstract: As a pseudo- alloy, Mo/Cu composite material has low thermal expansion coefficient as molybdenum and h igh therm al conductivity as copper. Furthermore, the therm al expansion coefficient, electrical and thermal conductivity ofMo/Cu composites can be designed by changing the ingred ient proportion ofMo /Cu. These charac- teristicsm akeMo /Cu composites be w idely used for electron ic pack ing, heat sink materials, devices of large scale integrated circu its and some related fields. W ith the electron ic information technology trends to m icromation, high - capacity and h igh reliab ility, more stringent requ irements on electrical and thermalproperties of theMo /Cu com- positesw ere proposed. Thus, continuous innovation and developm ent of preparation technique ofM o/Cu composites w ere also promoted. K ey w rds:Mo- Cu alloys, mu lti- layer composites materia;l preparation techn ique Mo/Cu 20 0 前 言 0, Mo (Mo/Cu) Cu, , Cu , M o/Cu , Mo/Cu , 70 , , Mo/Cu , /, , Mo/Cu,