GB/T 12560-1999半导体器件　分立器件分规范.pdf

ics31.080.01 L 40 场黔 中 华 人 民 共 和 国 国 家 标 准 cB/T 12560-1999 idtIEC747门1:1985 QC750100 半导体器件 分立器件分规范 Semiconductordevices Sectionalspecificationfordiscretedevices 1999一08一02发布 2000一03一01实施 国 家 质 AIX技 术 监 督 局 发布 Gs/T12560-1999 目 次 前言 ················。·································································································…… 工 IEC前言 ····························。······························。················································…… II 1 范围 ··························。····················································································…… 1 2 总则 ·························································································。···················…… 1 2.1 引用标准 ··········································································“························…… 1 2.2 温度的推荐值(优选值)········，················，，·······················，·，···‘…·… 二‘…·‘ 1 2.3 电压和电流的推荐值(优选值)·································································…·…二‘’··…1 2.4 引出端识别 ··························································，········································…… 1 2.5 型号的色标 ···································································································…… 2 2.6 与制造过程有关的定义 ················。····························································……’··…2 3 质量评定程序 ·····························。·····································································…… 3 3.1 初始制造阶段 ································································································…… 3 3.2结构相似器件 ············