电子元器件封装图片.xlsVIP

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  • 2015-09-17 发布于山西
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Sheet3 Sheet2 Sheet1 AC97 v2.2 specification AGP 3.3V Accelerated Graphics Port Specification 2.0 AGP PRO Accelerated Graphics Port PRO Specification 1.01 AGP AMR Audio/Modem Riser AX078 AX14 BGA Ball Grid Array BQFP132 EBGA 680L LBGA 160L PBGA 217L Plastic Ball Grid Array SBGA 192L TEPBGA 288L TSBGA 680L C-Bend Lead CERQUAD Ceramic Quad Flat Pack CLCC CNR Communication and Networking Riser Specification Revision 1.2 CPGA Ceramic Pin Grid Array Ceramic Case LAMINATE CSP 112L Chip Scale Package DIMM 168 DIMM DDR DIMM168 Dual In-line Memory Module Pinout DIMM184 For DDR SDRAM Dual In-line Memor

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