Ultra_Thin_Copper_Foil_HDI.pdf

中国PCB 技术网 http :// Ultra Thin Copper Foil for HDI Applications H. P. Cheskis, S. F. Chen, W. L. Brenneman and T. Ozaki POSTED: 11/01/2004 The evolution of electronic products, which are smaller, faster, more functional and more cost-effective, has catalyzed the need for HDI technology. As this technology is more widely applied, the need for printed circuits with finer features, controlled geometry, fewer layers, and simplified wiring configurations becomes increasingly critical. In particular, IC substrates and chip-on-flex applications are leading technologies, which are pushing the limits of fine features, controlled geometry, and microvias. Figure 1 shows typical IC substrate and chip-on-flex products. Critical to producing these components is the availability of thinner laminates with ultra thin copper layers. Figure 1. Typical IC substrate and chip-on-flex devices. There are a number of approaches for achieving ultra thin copper for the aforementioned copper clad laminates (CCL). These are outlined as follows : Soft Etch: Thicker foils are laminated and then etched down to reduce the copper thickness before laser drilling and photo resist application. Reportedly, thickness control and coarse foil treatment height are issues, which subsequently can affect line width control associated with undercutting. Additive: In this process, polyimide films are metalized (sputtered) and then electroplated with a thin layer of copper. The negative aspects of this approach include pinholes, low peel strength after thermal cycling, and special etching chemistries can be required to remove the metalized layer. Semi-Additive: In this build-up approach, the dielectric is chemically roughened prior to the application of the elec