《Guidelines for Handling J-Lead》.pdf

Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack (QFP), and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA packaging) devices to preserve the quality of these devices during storage, shipment, and transfer and to ensure easier soldering. Devices that use surface-mount J-Lead, QFP, BGA, FBGA, and lidless BGA are now common on boards because they provide density, size, and cost benefits. However, a few precautions are necessary to protect these devices from mechanical damage during transportation and storage. This application note describes the following topics: ■ “Handling J-Lead and QFP Devices” on page 1 ■ “Transferring Devices Between Tubes” on page 13 ■ “Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays” on page 13 ■ “Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices” on page 14 ■ “Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes” on page 19 Handling J-Lead and QFP Devices To protect device leads and ensure proper operation, you must handle J-Lead and QFP devices carefully when they are stored, shipped,