简易型LED粘片机开发和研究.pdfVIP

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  • 2015-12-01 发布于安徽
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Abstract to ontlle and inLED AccordingstIlding processof印oxyndroppingchipplacing thesismesto a LEDdiebonder.Themesishasstlldiedand packaging,the deVelopsimple discussedthe ofmotion methodsthat designs mechanjsm,contrDllingtechniques,location basedon pattemrecognition,motioncoⅡtrollingalgorithrn,motion methodsand ofit con廿ol haVe廿1ecertainacademicand Value. design

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