VLSICAD-2013习题课技术分析.ppt

International Technology Roadmap for Semiconductors(ITRS)国际半导体技术发展路线图的预测 SOC和SOP、SIP SoC：System-on-Chip（片上系统）:A SoC is a VLSI system that utilizes a large number of transistors to incorporate several kinds of function blocks into a single chip（把不同的功能模块集成到一个芯片中）, which offers the most compact and light-weight design SiP：System-in-Package（内封装系统）:SiP provides an alternative way to improve system performance and decrease power consumption, while solving some problems faced by SoC [3][8]. Instead of incorporating all the function blocks into one chip, a SiP contains multiple chips combined into a single package（一个封装包含多个芯片）, whose dimension is typically on the same order of magnitude as one chip’s package. SoP：System-on-Package（全集成封装系统）， is a new concept of SiP, which utilizes thin film technology to combine passives into the package（利用薄膜技术把无源元件嵌入到封装中）. RF-SOP is “to provide a complete packaging solution for RF module by integrating embedded passives components and MMIC at the package level”. SOC、MCM（multichip module）、SIP、SOP Technology mapping procedure（工艺映象流程） 布线通道中轨道（track），主干（trunk），枝干（branch），曲干或狗腿（dogleg）。 布线通道中轨道（track），主干（trunk），枝干（branch），曲干或狗腿（dogleg）。 PSpice应用中最重要的一个概念Simulation Profile(模拟类型分组) Simulation Profile(模拟类型分组)及每组包括的分析功能类型 A A A B B G G G D D E E F F F C C H H H H Step 6: rule 5 on nets C and F, rule 4 on H: A A A B B G G G D D E E F F F C C H H H H Step 7: connect and terminate nets B and D, rule 4 on C: A A A B B G G G D D E E F F F C C H H H H Step 8: connect G and H: A A A B B G G G D D E E F F F C C H H H H Step 9: rule 4 on C, E, G, and H, connect F: A A A B B G G G D D E E F F F C C H H H H Step 10: connect and terminate E and G, rule 4 on H : A A A B B G G G D D E E F F F C C H H H H Step 11: rule 4 on A, C, F : A A A B B G G G D D E E F F F C C H H H H Step 12: connect and terminate A, rule 4 on C, F : A A A B B G G G D D E E F F F C C H H H H Step 13: connect and terminate C and F : Determine a routing for these two channels using the