学士学位论文alsn复合材料的制备与界面研究.docVIP

摘 要 铝和铜的物理性能相近，可作为导电材料替代部分铜材，但铝的氧化能力强，给铝的焊接带来了许多困难，导致铝的应用范围受到限制。本文探讨在铝的表面复合一层金属锡，阻止铝表面氧化膜的形成，使铝的焊接性能得到改善。 本文利用机械的方法，去除铝基体上的氧化膜，再通过固-液复合的方法，制备出界面结合良好的Al-Sn复合材料。 利用SEM、XRD等测试手段对该复合材料界面处的形貌组织和物相进行表征。采用剥离实验定量测定了其界面剥离强度，自主研发了超声波界面结合强度测试方法。通过研究该复合材料的可焊性，分析该复合材料在电子产品中替代部分铜材的可行性。此外，以Sn为中间过渡层，制备出铝-铅复合材料。研究了铝-铅复合材料的电化学性能，探讨了铝-铅复合材料在铅酸蓄电池作为板栅材料的科学性及可行性。 实验结果表明：采用本文研发的制备工艺，可制备出界面结合良好的Al/Sn复合材料。XRD分析结果表明Al/Sn复合材料界面处形成同时兼有面心点阵和体心点阵的结构特征的间隙式固溶体。复合材料界面结合强度大。焊接后，焊缝的剪切强度高于铝基体的抗拉强度，能够方便地使用传统锡基焊料（包括无铅焊料）进行焊接，在IT产业中有望作为导电材料可部分替代铜箔。在Al/Sn复合材料的基础上制备的Al/Pb复合材料，阳极极化现象得到了改善，且具有较强的耐腐蚀性能，内阻低、析氢电位高，可用作铅酸蓄电池板栅材料。 关键词：Al/Sn 复合材料 界面 Al/Pb 电化学 Abstract Due to the similar physical properties of Al and Cu, Al can be used as substitute conductive material of Cu. But the strong oxidizability takes many difficulties to the weld of Al which constrict the application field of Al. This article discusses the effects of the method, which is plating a layer of Sn on Al, which is used to prevent the formation of oxide film that can improve the welding properties. Mechanical method was used to remove the oxide film in this article. And Al-Sn composites were prepared with fine combination through solid-liquid bonding method. The interfacial appearance, microstructure, and composite phases were characterized by SEM, XRD and so on. Then peeling strength was measured by peeling experiment which was self-developed combined with ultrasonic technology. Solderable research was used to study the feasibility that the composite substitute for Cu in the electronic industry partly. In addition, Al-Pb composite was also prepared taking Sn as a buffer layer, the electrochemical performances of it were investigated to explore the scientificity and feasibility of the composite which was taking as grid alloy for lead-acid batteries. The experiments show that Al-Sn composite with fine phase combination can be prepared through the preparing methods within the article concerned. In the interfacial area, XRD results show that