mcm__l的散热通道分析研究-大学生毕业设计（论文）说明书.docVIP

编号： 毕业设计说明书 课 题： MCM-L的散热通道 分析研究 题目类型：(理论研究 (实验研究 (工程设计 (工程技术研究 (软件开发 摘 要 多芯片组件是继之后世纪年代在微电子封装领域兴起并得到迅速发展的一项最引人瞩目的新技术。MCM）的出现标志着电子组装技术在高密度、高速度、高性能的方向上进入了更高的层次。但是，随着MCM集成度的提高和体积的缩小，其单位体积内的功率消耗不断增大导致发热量增加和温度急剧上升，从而强化了组件内部由热驱使所形成的机械、化学和电等诸方面的相互作用。如果结构设计或材料选择不合理，MCM工作时热量不能很快地散发出去会导致MCM内外的温度梯度过大，在MCM内部形成过热区或过热点使元器件性能恶化。因此MCM的热设计和散热技术的研究具有非常重要的作用。 目前，对MCM的散热方法多种多样，而风冷散热是比较普片化，因为风冷成本使用方便。本文选用风冷散热器模型，运用ANSYS软件对所选择的MCM进行散热分析。选择不同的材料不同的模型散热器进行散热分析比较。再综合风扇(电机)，选择最优的散热器模型进行对MCM-L进行散热。把芯片最高结温尽可能的降低降低MCM-L的热失效率，挺高它的寿命和挺高可靠性。 多芯片组件；热失效；热可靠性；散热器ABSTRACT MCM is following rise in the 1990 of the 20th century in the field of microelectronics packaging and SMT is the rapid development of one of the most fascinating new technology. MCM marked the emergence of electronic assembly technology in high density, high speed, high performance into a higher level in the direction. However, with the improvement of MCM integrated and volume reduction, increasing power consumption in its unit volume, resulting in increased heat and temperature rising sharply, thus strengthening the formation of a component driven by internal heat mechanical, chemical and electrical, and other aspects of interaction. If the structure or design materials selection is unreasonable, MCM heat cannot be disseminated quickly while you work out, can lead to excessive temperature gradient inside and outside the MCM, in the formation of MCM internal overheating or hot spots makes components performance worse. Therefore, the MCMs thermal design and research on heat dissipation technology has a very important role. Currently, the MCM method of heat sink variety of cooling is more general, because cheap air cooling cost easy to use. This selection of air cooling radiator model, application of ANSYS software to the MCM thermal analysis you select. Choose a different material analysis and comparison of different models of heat sink thermal. Integrated fan motor, selecting optim