高分子方法-热(TG、TMA、DSC、DMTA、DETA)概念.ppt

Medium vinyl SSBR vinyl BR50wt%,St 23wt% 10805 Tm 102?C 10804 Tm 82?C 10801 Tm 76?C 测试结果 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 Tp 100?C T0 ?30?C E0 2000kV/m tp1 60min tp2 120min heating rate 1?C/min WRC 10805 WRC 10804 WRC 10801 Temperature ?C Current 10?10 A online cure monitoring conductivity kS/m Temperature ?C time min 140 120 100 80 60 40 20 0 10 20 30 40 50 60 12 10 8 6 4 2 0 10 Hz 100 1000 10000 glass fibre reinforced epoxy resin Dielectric Thermal Analysis DETA + + ? + ? + ? + ? + ? ~ V + + ? + ? + ? + ? + ? + + ? + ? + ? + ? + ? ? ? ? 交变电场下的极化 C0 Q C0V C0V0sin?t ~ 两导电板间为真空，纯电容 V V0sin?t 电容电流 Ic dQ/dt C0?V0???cos?t 导前电压?/2 R C 两导电板间夹有电介质，相当于一个电容与一个电阻并联，电流为二者之和 Ic C0?V0???cos?t 电容电流—— Ir V0/R ?sin?t 与电压同相 总电流Itotal导前电压一个相角? Ic C?V0???cos?t 导前电压?/2 电阻电流—— voltage-current relationship in a capacitor 0.0 0.5 1.0 1.5 2.0 I V ? applied voltage V measured current pA time ms ?’ ?” ?’就是介电常数 ?”的本质是电导，称作损耗因子 损耗角正切 ?’ ?” 107 106 105 104 103 107 106 105 104 103 10?2 10?1 100 101 Modulus Pa log Frequency Hz Viscosity Pa.s Flow dominates Elastic dominates E’ ?* 常用的频率扫描 频率扫描与温度扫描的等效性 log Temperature G” G’ log Frequency G” G’ log Moduli log Moduli Tack与Peel行为 log ?* log E’ log ? E’ E’ ?* ?* bad good Tack Peel 不同条件的影响范围不同，低频响应影响手工操作，高频响应影响机械操作 Normal prepreg Aged at low T Aged at RT log Frequency log ?* 橡胶充油的影响 ?*充油 ?*未充油 E’未充油 E’充油 Frequency in Hz 108 107 106 105 Viscosity ?* Pa.s Storage modulus Pa 108 107 106 105 支化的影响 linear long chain branching log ?* log G’ log ? 0.01 0.1 1 10 100 5.3 时间/温度扫描 研究固化体系 Moduli Pa E’-E” crossover~gelation point Possible vitrification point Curing Minimum viscosity time, length, temperature Slope of line is related to Ea melting and/or compaction 106 Pa ~ Solidity E’ E” ?* Complex viscosity Pa.s 108 107 106 105 104 103 102 101 100 50 70 90 110 130 150 108 107 106 105 104 103 102 101 Temperature 六个信息： ① minimum viscosity ?*min ② time to ?*min ③ length of ?*min ④ onset