SMT defect countermeasure- level I.pptVIP

Start Slide Contents Objectives/ 目的 SMT Defects Identification/ SMT缺陷确定 Major Contributor to Defects/ 缺陷的主要分布 Failure Analysis/ 缺陷分析 Where to start your Investigation - “Three simple questions” 三个简单问题 Two Avenues of Investigation/ 两种调查途径 “Historical Research” 历史记录调查 Tests Investigations/ 测试, 调查 Find The Root Cause/ 找到问题的根本原因 “Fish-bone” Chart/ 鱼骨图 Effective Use of Background Information/ 有效利用信息 The DMAIC Process/ DMAIC 流程 SMT Defects and Countermeasure /SMT缺陷及防范措施 Tombstoning/ 立碑 Component Damaged (Nicks, Cracks, or Stress Fractures)/ 元件损坏 Component Damaged (Nicks, Cracks, or Stress Fractures)/ 元件损坏 Misalignment/ 偏位 Misalignment/ 偏位 Component Lead Lifted 元件引脚翘高 Component Lead Lifted/ 元件引脚翘高 Solder Ball/ 锡珠 Solder Ball/ 锡珠 Solder Ball/ 锡珠 Non-Wetting, Dewetting/ 虚焊，半润湿 Non-Wetting, Dewetting/ 虚焊，半润湿 Cold Solder/ 冷焊 Cold Solder/ 冷焊 Cold Solder/ 冷焊 Disturbed Solder/ 焊锡紊乱 No Solder/ 无锡 No Solder/ 无锡 Insufficient Solder/ 少锡 Insufficient Solder/ 少锡 Excess Solder/ 多锡 Excess Solder/ 多锡 Wrong Orientation/ Polarity 反向, 极性反 Wrong Orientation/ Polarity 反向, 极性反 Wrong Orientation/ Polarity 反向, 极性反 Solder Hole/ 锡洞 Solder Hole/ 锡洞 Solder Projections/ 锡尖 Solder Projections/ 锡尖 Others 其它 End This can be simulated by printing a board once then applying a small theta offset to Th e software (265/288) or making a small table adjustment (248/260) then reprinting the same board. NB When bridging is observed an under screen clean must be performed before printing another board. This can be simulated by printing a board once then applying a small theta offset to Th e software (265/288) or making a small table adjustment (248/260) then reprinting the same board. NB When bridging is observed an under screen clean must be performed before printing another board. 2nd Some/some =worst; little help The more historical data, the less tests. ? Solder has not wetted to the land or termination where solder is required. 　虚焊: 需要焊接的引脚焊盘不润湿． ? Solder coverage does no meet requirements fo