Copper based composite L-Cop.pptVIP

Copper based composite:L-Cop Cu High thermal Conductive Cu2O Low thermal expansive Introduction Application Electronic devices to achieve long life and reliable performance High current power modules To reduce high shear stress at soldering joint Mismatch in coefficient of thermal expansion between ceramic substrate to Cu/Al base plate attachment Silicon carbide reinforced aluminum SiC/Al Difficult to machine due to high ceramic content Cu/Mo Cu/W Composite Difficult to manufacture – Sintering at above 2000°C L-Cop: powder-metallurgy process Electrolytic Cu powder and CuO powder are