Wire_Bond_Introduction.pptVIP

Wire Bond Introduction Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Formation of a first bond Formation of a first bond Formation of a first bondContact Formation of a first bondBase Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Formation of a loop Formation of a loop Formation of a second bond Formation of a second bondContact Disconnection of the tail Disconnection of the tail Formation of a new free air ball pad lead Calculated Wire Length WIRE CLAMP ‘CLOSE’ pad lead Calculated Wire Length pad lead SEARCH DELAY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead 2nd Search Height Search Speed 2 Search Tol 2 pad lead Search Speed 2 Search Tol 2 pad lead Search Speed 2 Search Tol 2 pad lead heat pad lead heat heat pad lead heat heat Formation of a second bondBase pad lead pad lead pad lead pad lead Tail length pad lead pad lead pad lead pad lead * 目錄 Wire Bond(銲線)的意義 Wire Bond四大基本要素 Wire Bond原理 銲針規格 銲針的選擇 Chamfer徑的影響 Chamfer Angle的影響 Wire Bond 動作 球型大小因素及注意事項 球型大小與推球拉力的關係 Wire Bond (銲線)的意義 依照銲線圖(BONDING DIAGRAM),將已經黏在導線架(LEADFRAME,俗稱釘架)的晶粒(DIE,即積體電路)上的鋁墊(BOND PAD),與導線架的內引接腳(FINGER)銲上金線,以便導線架外腳-內腳能夠連接,使晶粒所設計的功能得到正確的輸出。 Wire Bond四大基本要素 目前電子產品銲接是採用固態銲接,所謂固態銲接就是金屬在未達溶解溫度下銲接,而決定固態銲接固態銲接的四大基本要素如下: 振幅大小及振盪頻率(POWER) 銲接壓力(FORCE) 銲接時間(TIME) 銲接溫度(TEMPERATURE) Wire Bond 原理 鋁墊的第一層是很薄的水氣及雜質,因為金屬有吸引力而空氣中有水氣及雜質之故 ,第二層是氧化鋁,因為鋁會氧化所以有一層氧化鋁,而氧化鋁很硬無法跟金屬做最佳之接合,第三層才是純鋁,而最佳之銲接就是金球跟純鋁做