UV激光切割机特点说明.pptVIP

產品構造 （ Product structure） 油墨蝕刻 ink etching 傳統模具生產FPC和鐳射生產FPC的對比Comparison of FPC manufacture by using traditional mold and laser 傳統模具生產FPC和鐳射生產FPC的對比 Comparison of FPC manufacture by using traditional mold and laser * * UV鐳射切割機相对优点介紹 Introduction of UV Laser Cutting Machine 廣東正業科技股份有限公司 Guangdong Zhengye Technology Co., Ltd UV鐳射切割機 UV Laser Cutting machine JG13A JG13B 目 錄catalogue 一、產品構造 （ Product structure） 二、應用領域 （Applications ） 三、性能特點 （ Characteristics） 四、相对模具优势 （compared with mold 五、同类对比 Compared to the same ） 鐳射頭罩Laser Hood 雷射器罩 Laser shield 電櫃Electric cabinet 吸塵罩Dust absorb cover CCD相機 CCD Camera 蜂窩板 Honeycomb panels 真空吸附工作臺 Vacuum absorbing platform 真空吸附軟管Vacuum absorbing pipe 花崗岩臺平臺Granite platform XY直線電機工作臺XY Linear motor working platform 花崗岩支腳Granite legs 腳杯Foot Cup 應用領域 Applications FPC 矽片Silicon 100um CVL 蝕刻部分 etching part 應用領域 Applications 微孔精密切割 micro-via cutting micro-via precisively cutting 性能特點 Characteristics 紫外鐳射切割主要優點： main functions of the UV laser cutting: ⑴ 切割各種撓性線路板材料和覆蓋膜，乾淨輕微碳化，包括常見的製造電路板的材料和製造元部件的材料； For a variety of flexible circuit board material and cover film cutting, including the materials of circuit boards and component parts manufacturing; ⑵ 具備高質量、高速度切割剛性材料的功能，厚度可達 1mm 0.04″ 。加工後幾乎無毛刺，也沒有熱作用產生的分層。切割的結果精密、光滑，側壁陡直；cutting rigid material with high-quality and high speed with the thickness up to 1mm 0.04 . Almost no burr and no heat effect produced by stratification, high precision, smooth and steep side wall; ⑶可切割各種基底材料，如：矽片、陶瓷、玻璃等； Used for a variety of substrate materials cutting, such as: silicon, ceramics, glass, etc. ⑷各種功能薄膜的精密刻蝕成型。 Precisive etching of various functional thin films. 我司紫外鐳射切割優點： main functions of our UV laser cutting: 1 高性能紫外雷射器：採用高光束品質、高峰值功率、窄脈寬、高脈衝穩定度的10W/355nm全固態紫外雷射器，保證加工品質和穩定性； High-performance UV laser: 10W/355nm all solid-state ultraviolet laser with high beam quality, high peak power, narrow pulse, high pulse stability to ensure the quality and stability of